Fabless ASIC & SoC
Functional specification, RTL/IP lineage, PPA targets, signoff dependencies, tape-out readiness.
INDUSTRIES / SEMICONDUCTOR
From transistor to test floor.
Semiconductor manufacturing is not one workflow. Silicon360 models each segment on its own terms while preserving the connections between them.
01 / DESIGN INTELLIGENCE02 / PRODUCTION REALITY03 / MACHINE EXECUTION
INDUSTRY MAP
A manufacturing system with distinct technical domains.
The same product may cross design houses, foundries, packaging partners, qualification labs, board factories and EMS plants.
Silicon foundries
Process route, masks, material specs, fab equipment, metrology, excursions, capacity and yield.
Compound semiconductors
SiC / GaN substrate, epi, defects, process windows, power/thermal reliability and qualification.
Analog, RF & mixed signal
Parametric test, process variation, RF performance, calibration and silicon-to-package constraints.
OSAT & advanced packaging
Assembly flow, package design, wafer sort, die attach, flip-chip, burn-in and test traceability.
PCB fabrication
Stack-up, material availability, trace/space, drill, impedance, panelization, fab capability.
PCBA & EMS
AVL, SMT programs, setup constraints, reflow, AOI/SPI/X-ray and manufacturing yield.
Semiconductor equipment
Equipment capabilities, recipe dependencies, maintenance status and communication interfaces.
Automotive & industrial electronics
Traceability, functional safety context, controlled changes, reliability and long-lifecycle supply.
DOMAIN MODELS
Process-aware intelligence.
A wafer lot, a ceramic substrate and a PCB placement file are not interchangeable abstractions.
TECHNICAL SYSTEM
SEMICONDUCTOR TWIN
A typed process and configuration model extends the product graph.
Design ↔ mask_set ↔ process_route
Wafer_lot ↔ metrology ↔ yield_state
Die ↔ package ↔ assembly_process
Test_result ↔ requirement ↔ revision
Factory_capability ↔ validated_process_window