Understand
AI-led ingestion of requirements, schematics, netlists, BOMs, process documents and supplier data.
SILICON360 / AUTONOMOUS MANUFACTURING INTELLIGENCE
Manufacturing has a new intelligence layer.
A revolutionary AI-native application connecting semiconductor design, supply, cost, process constraints and factory execution. Run it as your system of record—or connect it to the systems you already operate.
01 / DESIGN INTELLIGENCE02 / PRODUCTION REALITY03 / MACHINE EXECUTION
STANDALONE SAASORINTELLIGENCE OVER YOUR EXISTING STACK→ONE FUNCTIONAL DIGITAL TWIN
THE SHIFT
Beyond a PLM system.
A model of how products are made.
Drawings, BOMs and approvals are representations of a product. Silicon360 DTFM links the intent behind them to what machines, materials, processes and suppliers can actually deliver.
01
Intent
Language, design files, specifications
02
Twin
Functions, constraints, evidence
03
Validate
Electrical, process, cost, supply
04
Release
Controlled build configuration
05
Execute
Fab / packaging / PCB / SMT
THE PRODUCT
A continuous path from engineering to production.
The platform interprets product intent, builds a version-aware digital twin, evaluates constraints and prepares validated manufacturing decisions.
Model
A functional knowledge graph ties features to parts, geometry, test limits, materials, costs and factory capabilities.
Validate
Design and manufacturing checks produce evidence, not ungrounded AI confidence.
Optimize
Explore yield, capacity, alternate materials, inventory and cost trade-offs by scenario.
Release
Policy-controlled changes, traceable revisions and electronically signed production configurations.
Execute
Translate released configurations into qualified manufacturing packages and adapter-specific formats.
FROM WAFER TO BOARDOne product intelligence model.
Explore industry coverage
One product intelligence model.
Different manufacturing realities.
Explore industry coverage INDUSTRY DEPTH
Built around the physics and economics of manufacturing.
Not a generic factory chatbot. Different processes require different constraints, validation evidence and production interfaces.
Foundries & wafer fabrication
Process nodes, lots, recipes, equipment states, process windows, yield and metrology.
Fabless ASIC / SoC
Design intent, IP dependencies, PPA targets, timing constraints, verification, tape-out and signoff.
SiC & power semiconductors
Substrate quality, epitaxy, high-voltage process controls, thermal limits, reliability and qualification.
OSAT & advanced packaging
Die attach, wire bond, flip-chip, substrates, test coverage and package-level yield.
PCB fabrication & PCBA
Stack-up, panelization, paste, placement, inspection, reflow, traceability and change impact.
Equipment & EMS
Machine-specific adapters, feeder and program preparation, MES feedback and work-order constraints.
CUSTOM AI ARCHITECTURE
Domain intelligence, not another general-purpose assistant.
DTFM is designed as a proprietary model layer over leading foundation LLMs, grounded in product knowledge, validated engineering rules and real-time enterprise data.
TECHNICAL SYSTEM
DTFM MODEL STACK
Specialized capabilities operate together over an auditable functional twin.
DTFM-Intent → natural language to typed requirements
DTFM-Graph → product entities and causal dependencies
DTFM-Cost → should-cost and scenario modeling
DTFM-Verify → evidence-gated engineering validation
DTFM-Factory → equipment-specific release translation
CONNECT OR REPLACE
Works with your infrastructure.
Or becomes it.
Choose a standalone product record, or a system overlay that consumes and returns information to existing engineering, planning and factory tools.
ENTERPRISE SYSTEMSECAD · PLM · ERP · MES · QMS
API / event / document adapters
SILICON360DTFM CONTROL PLANE
MANUFACTURINGFab · OSAT · PCB · SMT
Validated packages / equipment interfaces